MSD: Moisture Sensitive Devices |
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Moisture Sensitive Devices (MSDs), must be managed correctly because “a single mistake” on a tray or reel of MSD causes “negative impact on the entire production batch”. Electronic components (like QFP, BGA or SOIC for example), LEDs and Printed Circuit Boards, when extracted from their original protective package, absorb humidity from the environment and during the soldering process the trapped moisture can vaporize and exert internal package stress. Possible damages are: package cracking (popcorn), interfacial delamination, thermal or electrical connection interrupted and possible long-term corrosion. |
Standards
The most important international standard concerning the MSDs are: J-STD-033 “Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices” IPC-1601 “Printed Board Handling and Storage Guidelines” |
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Dry cabinets provides a “safe place” to temporary stock the MSDs removed from their original Dry Pack before soldering process.
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According to the IPC-1601 baking of the PCBs should be done at 105-125°C for 4-6 hours into a forced air recirculating oven. |
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After reels extraction from their Dry Pack and partial assembling and soldering of the components, what to do with the left parts? |